The report, citing sources within Apple's supply chain, claims the eight cores in the tentatively named A11X Bionic chip will include three high-performance "Monsoon" cores and five energy-efficient "Mistral" cores.
Like the A11 Bionic chip in the latest iPhone models, which is built on a 10-nanometer process, the A11X chip will reportedly feature TSMC's integrated fan-out wafer level packaging, or InFO WLP for short.
The chip will also presumably include a next-generation M11 coprocessor and neural engine for artificial intelligence tasks, such as processing facial recognition given rumors about Face ID on 2018 iPad Pro models.
The eight-core processor should unsurprisingly result in CPU performance improvements on next-generation iPad Pro models.
Our own Chris Jenkins provided an in-depth look at the architecture of Apple's A11 Bionic chip. He also highlighted details about TSMC's improved 7nm process and advanced InFO packaging process for 2018.
Apple's current 10.5-inch and 12.9-inch iPad Pro models have an A10X Fusion chip based on TSCM's 10nm fabrication process.
In addition to gaining Face ID, next-generation iPad Pro models are expected to have an iPhone X form factor with slimmer bezels and no Home button. However, the tablets will reportedly continue to have LCD displays due to yield rates.
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